Explore the latest advancements in SMT and hybrid packaging at the SMT HYBRID PACKAGING System Integration in Micro Electronics Exhibition & Conference! This renowned event gathers industry professionals under one roof, showcasing innovative technologies, equipment, materials, and solutions. Discover the latest trends and discuss current challenges with experts in the field. Gain valuable insights into emerging technologies and best practices to enhance your product designs and manufacturing processes.

Messe Muenchen hosts SMT HYBRID PACKAGING, a flourishing platform that brings together over 400 exhibitors and welcomes more than 10,000 attendees from the world over. It is the go-to event for electronics and packaging professionals seeking to network, exchange ideas, and stay up-to-date with the latest industry developments.

Real Time Systems & Embedded Systems Electronic Design & Components