IC SENSOR PACKAGING EXPO JAPAN NAGOYA is Japan's leading exhibition for IC final manufacturing, showcasing advanced equipment, materials, and services. It brings together manufacturers, suppliers, and engineers from around the world to explore the latest innovations in assembly equipment, packaging materials, analysis and simulation software for IC packaging. Attendees can witness cutting-edge technologies, network with industry experts, and gain valuable insights into the future of IC manufacturing.

Electronic Design & Components Measurement Control & Testing