IC SENSOR PACKAGING EXPO JAPAN CHIBA is the leading exhibition in Asia for IC final manufacturing. It showcases the latest advanced equipment, materials, and services for IC packaging, including assembly equipment, packaging materials, analysis simulation software, and more. The expo attracts a global audience of professionals involved in the IC manufacturing industry, providing a platform for networking, knowledge exchange, and sourcing solutions for the latest IC packaging technologies.

Electronic Design & Components Measurement Control & Testing