IC SENSOR PACKAGING EXPO JAPAN TOKYO is a leading exhibition for IC final manufacturing in Asia. It gathers advanced equipment, materials, and services for assembly equipment, packaging materials, equipment analysis, simulation software for IC packaging, and much more.

IC SENSOR PACKAGING EXPO is a business platform for electronic engineers, R&D personnel, and decision-makers to network and discover the latest technologies and products in IC packaging and assembly. The exhibition features a wide range of products and services from leading manufacturers and suppliers in the industry.

The key performance indicators of IC SENSOR PACKAGING EXPO JAPAN TOKYO include:

* **Attendance:** Over 20,000 visitors from around the world
* **Exhibitors:** Over 500 exhibitors from leading companies in the industry
* **Floor space:** Over 20,000 square meters of exhibition space
* **Product categories:** Assembly equipment, packaging materials, equipment analysis, simulation software for IC packaging, and more.

Electronic Design & Components Measurement Control & Testing