IC SENSOR PACKAGING EXPO JAPAN is the leading exhibition in Asia for IC final manufacturing, presenting the latest advanced equipment, materials, and services for assembly and packaging. It's a hub for professionals in the IC packaging industry, bringing together suppliers and buyers to showcase their innovative solutions and services. The event features a wide range of exhibits, including assembly equipment, packaging materials, analysis and simulation software, and equipment. It offers an excellent opportunity to connect with industry experts, discover the latest technological advancements, and explore the newest trends. The EXPO attracts a large number of attendees, speakers, exhibitors and visitors.

Electronic Design & Components Measurement Control & Testing